King-Ning Tu

Electrical and Electronic Engineering · 2000–2020

A researcher in the Science corpus: 32 papers; trusts 3 researchers and is trusted by 16 researchers here, as inferred from the citation graph.

Subfields

Whom King-Ning Tu trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. K. Zeng
  2. Chih Chen

Who trusts King-Ning Tu overall

  1. Chih Chen
  2. Satish G. Kandlikar
  3. Hiren R. Kotadia
  4. Yan Cheong Chan
  5. Hsiang-Yao Hsiao
  6. K. Zeng
  7. Chih Chen
  8. Muammer Kaya
  9. Liang Zhang
  10. Yuan-Wei Chang

Papers from King-Ning Tu's perspective

Ordered by how strongly the researchers King-Ning Tu trusts endorse each paper. Same corpus, a different order for every researcher.

  1. Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
  2. Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints
  3. Thermomigration in SnPb composite flip chip solder joints
  4. Solder Joint Technology
  5. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
  6. Electromigration in Sn-Pb solder strips as a function of alloy composition
  7. Effects of Co and Ni addition on reactive diffusion between Sn–3.5Ag solder and Cu during soldering and annealing
  8. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
  9. A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni
  10. Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements

Their papers