Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints
By Lingyun Zhang, Shengquan E. Ou, Joanne Huang, King-Ning Tu, Stephen Gee, L. Nguyen. 2006
158 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials
View Paper: https://www.semanticscholar.org/paper/50b13a18d3f4673b400e22d78528f65eb7625948
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In Electrical and Electronic Engineering
In Electronic, Optical and Magnetic Materials
Citations in the corpus
- Failure mechanisms of solder interconnects under current stressing in advanced electronic packages (2010, unknown): “According to previous research, the principal reason for an incubation time was attributed to the process of void generation and propagation, and solder lifetime was explained and approached through modeling void accumulation [37,53].”
- Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints (2010, methodology): “Kinetic analysis on a two-dimensional model of pancake-type void growth has been published (22).”