Effects of Co and Ni addition on reactive diffusion between Sn–3.5Ag solder and Cu during soldering and annealing
By Feng Gao, T. Takemoto, H. Nishikawa. 2006
184 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/2976bbe9c0066d5312547c9beb842fadf9c1081e
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In Electrical and Electronic Engineering
In Mechanical Engineering
Citations in the corpus
- Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate (2013, background): “[6] has suggested the formation of Cu3Sn through the reaction Cu6Sn5 þ 9Cu / 5Cu3Sn.”
- Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging (2018, background): “Since the thermodynamic affinity of Ni-Sn is higher than that of Cu-Sn, the stability of (Cu, Ni)6Sn5 phase is better than that of Cu6Sn5 [41].”
- A review: On the development of low melting temperature Pb-free solders (2014, background): “Additionally, the Cu3Sn IMC was suppressed, and the overall IMC growth rate is reduced for the Sn–Ag–Ni/Cu and Sn–Ag–Co/Cu systems [102].”