Thermomigration in solder joints

By Chih Chen, Hsiang-Yao Hsiao, Yuan-Wei Chang, F. Ouyang, King-Ning Tu. 2012

154 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/55aae1f60fc99ce27954b2295d2382b371baf543