Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints

By Chih Chen, Ho-Ming Tong, King-Ning Tu. 2010

285 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/b74eaa19ee89907be528cb2f8c88e1bdb26d64c4

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In Electrical and Electronic Engineering

1. King-Ning Tu

In Electronic, Optical and Magnetic Materials

1. King-Ning Tu

Citations in the corpus

• Reliability challenges in 3D IC packaging technology (2011, background): “(c) Device engineers need to conduct heat away from the chip side by cooling, so a large temperature gradient will be created and thermomigration can be serous in the micro-bumps [15,16].”