Thermomigration in SnPb composite flip chip solder joints

By A. Huang, A. Gusak, King-Ning Tu, Y. Lai. 2006

153 citations recorded by the source corpus.

We have used composite flip chip solder joints to study thermomigration. The composite solder joint has 97Pb3Sn on the Si side and eutectic 37Pb63Sn on the substrate side. Redistribution of Sn and Pb occurs in thermomigration, and we found that Sn has moved to the Si side (the hot end) and Pb to the substrate side (the cold end). We estimate the driving force that a temperature gradient of 1000°C∕cm or a temperature difference of 10°C across a solder joint of 100μm in diameter is sufficient to induce the thermomigration.

Subfields: Atomic and Molecular Physics, and Optics, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/bd4377cf0580d22c5ea5126db67f3f6b553870ed

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In Electrical and Electronic Engineering

1. King-Ning Tu
2. Chih Chen
3. Ho-Ming Tong

Citations in the corpus

• Failure mechanisms of solder interconnects under current stressing in advanced electronic packages (2010, unknown): “This lateral TM was also observed in composite solder joints [109,114].”
• Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints (2010, background): “Composite solder joints have been used to study TM in particular because the large image contrast between Sn and Pb enables us to easily observe the effect of TM on phase change in SnPb solders (60, 74).”