K. Zeng
Electrical and Electronic Engineering · with Tu · 2001–2005
A researcher in the Science corpus: 5 papers; trusts 1 researcher and is trusted by 2 researchers here, as inferred from the citation graph.
Subfields
- Electrical and Electronic Engineering — 16 citations into it; #10,267 of 16,539 by trust here, #5,200 by citations
Whom K. Zeng trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Who trusts K. Zeng overall
Papers from K. Zeng's perspective
Ordered by how strongly the researchers K. Zeng trusts endorse each paper. Same corpus, a different order for every researcher.
- Solder Joint Technology
- Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
- Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints
- Thermomigration in SnPb composite flip chip solder joints
- Transparent conducting oxide semiconductors for transparent electrodes
- Transparent, Conductive Carbon Nanotube Films (Science)
- Crystalline Silver Nanowires by Soft Solution Processing
- Mechanisms of PVP in the preparation of silver nanoparticles
- Electrode Grids for ITO Free Organic Photovoltaic Devices
- Organic light-emitting diodes on solution-processed graphene transparent electrodes. (ACS Nano)
Their papers
- Six cases of reliability study of Pb-free solder joints in electronic packaging technology (2002) — 1,350 citations
- Tin–lead (SnPb) solder reaction in flip chip technology (2001) — 578 citations
- Effect of thermal aging on board level drop reliability for Pb-free BGA packages (2004) — 258 citations
- Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu (2002) — 248 citations
- Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability (2005) — 439 citations