Reliability challenges in 3D IC packaging technology
By King-Ning Tu. Microelectronics and reliability, 2011
633 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials
View Paper: https://www.semanticscholar.org/paper/f169d78f1e49d441b1e2f77b7f34adb3ed3636e3
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In Electrical and Electronic Engineering
In Electronic, Optical and Magnetic Materials
Citations in the corpus
- Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits (2014, background): “Such large gradients result in mechanical stresses, departures in device performance, and synchronization issues which lead to reliability concerns [59,60].”