Liang Zhang

Electrical and Electronic Engineering · with Dai · 2010–2019

A researcher in the Science corpus: 5 papers; trusts 2 researchers and is trusted by 0 researchers here, as inferred from the citation graph.

Subfields

Whom Liang Zhang trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. King-Ning Tu
  2. Tomi Laurila

Papers from Liang Zhang's perspective

Ordered by how strongly the researchers Liang Zhang trusts endorse each paper. Same corpus, a different order for every researcher.

  1. Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate
  2. Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate
  3. Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu
  4. Ag_3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys
  5. A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates
  6. Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates
  7. Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints
  8. Effects of Co and Ni addition on reactive diffusion between Sn–3.5Ag solder and Cu during soldering and annealing
  9. Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys
  10. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

Their papers