Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements

By D. Yu, Jing Zhao, L. Wang. 2004

236 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/13005eff2384deca9da22aee5da1b97870e2218f

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Hiren R. Kotadia
2. Philip D. Howes
3. Samjid H. Mannan

In Mechanical Engineering

1. Hiren R. Kotadia
2. Philip D. Howes
3. Samjid H. Mannan

Citations in the corpus

• A review: On the development of low melting temperature Pb-free solders (2014, background): “[110] reported that nanoparticulate Ag3Sn was seen to precipitate on the surfaces of Cu6Sn5 grains in the Sn–3.”