Hiren R. Kotadia

Electrical and Electronic Engineering · 2014

A researcher in the Science corpus: 1 paper; trusts 1 researcher and is trusted by 0 researchers here, as inferred from the citation graph.

Subfields

Whom Hiren R. Kotadia trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. Tomi Laurila
  2. King-Ning Tu

Papers from Hiren R. Kotadia's perspective

Ordered by how strongly the researchers Hiren R. Kotadia trusts endorse each paper. Same corpus, a different order for every researcher.

  1. Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements
  2. Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing
  3. Effects of Co and Ni addition on reactive diffusion between Sn–3.5Ag solder and Cu during soldering and annealing
  4. Phase equilibria of the Sn–Zn–Cu ternary system
  5. Solder Joint Technology: Materials, Properties, and Reliability
  6. Tin–lead (SnPb) solder reaction in flip chip technology
  7. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
  8. Electrical Contacts: Fundamentals, Applications and Technology
  9. A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni
  10. Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

Their papers