Solder Joint Technology

143 citations recorded by the source corpus.

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Thermomigration in solder joints (2012, methodology): “On driving force of atomic diffusion, we recall Fick’s first law that the atomic flux driven by composition gradient or chemical potential gradient can be given as [4,18,19],”
Reliability challenges in 3D IC packaging technology (2011, methodology): “Besides, we do not have enough data on the reliability of IMC.”