Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

By K. Zeng, R. Stierman, T. Chiu, D. Edwards, K. Ano, King-Ning Tu. 2005

439 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/d1d41a8a779a4288cca7a9f99054cb6000f5049d

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

1. Ya-Ting Wang
2. C. Kao
3. Y. W. Lin
4. C. Tu

Citations in the corpus

• Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu (2009, background): “Because the Cu3Sn growth had been linked to the formation of micro voids, which in turn increased the potential for brittle interfacial fracture [13], a thinner Cu3Sn might translate into better solder joint strength.”