A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni

By J. Tsai, Y. Hu, C. Tsai, C. Kao. 2003

154 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/749a9708cc5d24db41330d5c39086dd8baa2268c

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Abdul Haseeb
2. Hiren R. Kotadia
3. Philip D. Howes
4. Samjid H. Mannan

In Mechanical Engineering

1. Abdul Haseeb
2. Hiren R. Kotadia
3. Philip D. Howes
4. Samjid H. Mannan

Citations in the corpus

• A review: On the development of low melting temperature Pb-free solders (2014, background): “[103] studied Sn–Ag with Ni (at concentrations of 0 to 1 wt.”
• Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate (2013, background): “Just as in the case of nickel alloy addition [6,38,39], nickel was also detected in the interfacial Cu6Sn5 layer (Fig.”