Electromigration in Sn-Pb solder strips as a function of alloy composition
By Cheng-Yi Liu, Chih-hao Chen, King-Ning Tu. 2000
149 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials
View Paper: https://www.semanticscholar.org/paper/6ac21da131b60d6d5c467bce58ad033016be577a
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In Electrical and Electronic Engineering
In Electronic, Optical and Magnetic Materials
Citations in the corpus
- Failure mechanisms of solder interconnects under current stressing in advanced electronic packages (2010, unknown): “Also, whiskers in thin film solder strips have been detected under prolonged current stressing [14,99].”
- Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints (2010, background): “In particular, for solder joints with Cu columns or with TSV technology, the height of the solder bump may be as low as 20 μm (6).”