Solder Joint Technology: Materials, Properties, and Reliability

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Failure mechanisms of solder interconnects under current stressing in advanced electronic packages (2010, unknown): “At present, the diameter of a solder bump in use is about 100 lm or less [2].”
A review: On the development of low melting temperature Pb-free solders (2014, background): “% [3]) have proved to be problematic in terms of void formation, large undercooling during solidification, overly rapid IMC formation and spalling of interfacial IMCs during high temperature storage.”