Chih Chen
Electrical and Electronic Engineering · with Tong · 2010
A researcher in the Science corpus: 1 paper; trusts 1 researcher and is trusted by 1 researcher here, as inferred from the citation graph.
Subfields
- Electrical and Electronic Engineering — 12 citations into it; #16,284 of 16,539 by trust here, #15,217 by citations
- Electronic, Optical and Magnetic Materials — 8 citations into it; #2,822 of 2,886 by trust here, #2,777 by citations
Whom Chih Chen trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Who trusts Chih Chen overall
Papers from Chih Chen's perspective
Ordered by how strongly the researchers Chih Chen trusts endorse each paper. Same corpus, a different order for every researcher.
- Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
- Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints
- Thermomigration in SnPb composite flip chip solder joints
- Electromigration in Sn-Pb solder strips as a function of alloy composition
- Six cases of reliability study of Pb-free solder joints in electronic packaging technology
- Solder Joint Technology
- Theory of Elasticity
- International Technology Roadmap for Semiconductors 2003の要求清浄度について － シリコンウエハ表面と雰囲気環境に要求される清浄度, 分析方法の現状について －
- Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps (IEEE Transactions on Advanced Packaging)
- Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV) (Electronic Components and Technology Conference)
Their papers
- Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints (2010) — 285 citations