In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing

By Y. H. Lin, Y. Hu, Chang-Da Tsai, C. Kao, King-Ning Tu. 2005

151 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/d59740ca56d081898ff439640e2b9183c644b447

Citations in the corpus

• Failure mechanisms of solder interconnects under current stressing in advanced electronic packages (2010, unknown): “According to previous research, the principal reason for an incubation time was attributed to the process of void generation and propagation, and solder lifetime was explained and approached through modeling void accumulation [37,53].”