Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders

By Minhua Lu, D. Shih, P. Lauro, C. Goldsmith, D. W. Henderson. 2008

238 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/47e508ae02f2249dedaecb562f4c931f127eae46

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. King-Ning Tu
2. Chih Chen
3. Ho-Ming Tong

In Mechanical Engineering

1. King-Ning Tu

Citations in the corpus

• Failure mechanisms of solder interconnects under current stressing in advanced electronic packages (2010, unknown): “the effect of Ag in a Sn-based solder and concluded that the grain re-orientation of Sn was blocked due to the presence of cyclic twinning and a stable Ag3Sn IMC network, in turn the dissolution of UBM was comparatively mitigated [66].”
• Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints (2010, background): “Effect of Sn Grain Orientation on Electromigration and Transmigration Extrafast Cu and Ni dissolution may take place along specific Sn grain orientations (102).”