Hsiang-Yao Hsiao

Electrical and Electronic Engineering · 2012

A researcher in the Science corpus: 1 paper; trusts 1 researcher and is trusted by 0 researchers here, as inferred from the citation graph.

Subfields

Whom Hsiang-Yao Hsiao trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. King-Ning Tu

Papers from Hsiang-Yao Hsiao's perspective

Ordered by how strongly the researchers Hsiang-Yao Hsiao trusts endorse each paper. Same corpus, a different order for every researcher.

  1. Solder Joint Technology
  2. Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
  3. Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints
  4. Thermomigration in SnPb composite flip chip solder joints
  5. Electromigration in Sn-Pb solder strips as a function of alloy composition
  6. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
  7. An analysis of rechargeable lithium-ion batteries after prolonged cycling
  8. Graphene microsheets enter cells through spontaneous membrane penetration at edge asperities and corner sites (Proceedings of the National Academy of Sciences of the United States of America)
  9. Gas-phase production of carbon single-walled nanotubes from carbon monoxide via the HiPco process: A parametric study
  10. Preparation, Structure, and Electrochemical Properties of Reduced Graphene Sheet Films

Their papers