Six cases of reliability study of Pb-free solder joints in electronic packaging technology

By K. Zeng, King-Ning Tu. 2002

1,350 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/dc4f943a54e60a13e058d22d4713814a7353941d

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In Electrical and Electronic Engineering

1. King-Ning Tu
2. Chih Chen
3. Ho-Ming Tong

In Electronic, Optical and Magnetic Materials

1. King-Ning Tu
2. Chih Chen
3. Ho-Ming Tong

Citations in the corpus

• Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization (2004, background): “[1] observed voids in the NiSnP layer.”
• Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints (2010, background): “Most Pb-free solders are Sn-based alloys, and thus EM in Sn-based solders has attracted much attention because of poor field data availability (8).”