Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples

By H. Gan, King-Ning Tu. 2005

264 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/b43200393040f6fcf8508de2253c5cd0da9f18ca

Citations in the corpus

• Failure mechanisms of solder interconnects under current stressing in advanced electronic packages (2010, unknown): “7Cu/Cu interconnects under current stressing [74].”