Tin–lead (SnPb) solder reaction in flip chip technology

By King-Ning Tu, K. Zeng. 2001

578 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/579b13064e2c38f8b17ad126573f503173e7c776

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Hiren R. Kotadia
2. Philip D. Howes
3. Samjid H. Mannan
4. Muammer Kaya

In Mechanical Engineering

1. Hiren R. Kotadia
2. Philip D. Howes
3. Samjid H. Mannan
4. Muammer Kaya

Citations in the corpus

• Recovery of metals and nonmetals from electronic waste by physical and chemical recycling processes. (2016, background): “Vats and Singh (2015) assessed the Au and Ag in assorted mobile phone PCBs by subjecting them to roasting at 850 C and HCl acid digestion.”
• A review: On the development of low melting temperature Pb-free solders (2014, background): “Many studies have focussed on the chemical reactions of Sn, specifically with Cu and Ni substrates, as it is of major importance in Pb-free solders [3,4,6,32].”