Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

By T. Lee, W. Choi, King-Ning Tu, Jin-wook Jang, S. Kuo, J. K. Lin, D. Frear, K. Zeng, J. Kivilahti. 2002

248 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/938e57e28a327dc03583b824d0996c12e0b8377e

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In Electrical and Electronic Engineering

1. Liang Zhang

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Citations in the corpus

• Failure mechanisms of solder interconnects under current stressing in advanced electronic packages (2010, unknown): “It is well known that without current stressing, the growth of the IMC layer follows a parabolic behavior [85,86].”
• Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging (2018, background): “Figure 1 shows a schematic diagram of IMC growth, in which the arrows indicate the diffusion path of Cu [19].”