Guo-Quan Lu

Electrical and Electronic Engineering · 2002–2010

A researcher in the Science corpus: 8 papers; trusts 2 researchers and is trusted by 10 researchers here, as inferred from the citation graph.

Subfields

Whom Guo-Quan Lu trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. J. Bai

Who trusts Guo-Quan Lu overall

  1. Vemal Raja Manikam
  2. J. Bai
  3. J. Calata
  4. Kim S. Siow
  5. T. Lei
  6. Kuan Yew Cheong
  7. Xu Chen

Papers from Guo-Quan Lu's perspective

Ordered by how strongly the researchers Guo-Quan Lu trusts endorse each paper. Same corpus, a different order for every researcher.

  1. Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material (IEEE transactions on components and packaging technologies)
  2. Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly (IEEE transactions on device and materials reliability)
  3. High-temperature electronics - a role for wide bandgap semiconductors? (Proceedings of the IEEE)
  4. Void induced thermal impedance in power semiconductor modules: some transient temperature effects (Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248))
  5. Thermal behavior of silver nanoparticles for low-temperature interconnect applications
  6. Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments (IEEE Aerospace Conference. Proceedings)
  7. Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
  8. Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys
  9. Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
  10. Silicon carbide benefits and advantages for power electronics circuits and systems (Proceedings of the IEEE)

Their papers