Kuan Yew Cheong

Materials Chemistry · 2002–2013

A researcher in the Science corpus: 6 papers; trusts 22 researchers and is trusted by 1 researcher here, as inferred from the citation graph.

Subfields

• Materials Chemistry — 48 citations into it
• Electronic, Optical and Magnetic Materials — 40 citations into it
• Electrical and Electronic Engineering — 36 citations into it; #14,333 of 16,539 by trust here, #8,489 by citations
• Biomedical Engineering — 29 citations into it
• Organic Chemistry — 20 citations into it
• Atmospheric Science — 5 citations into it

Whom Kuan Yew Cheong trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

1. J. Bai
2. Krishna Balantrapu
3. Guo-Quan Lu
4. K. Chou
5. Dingsheng Wang
6. Wei Yu
7. T. Tolaymat
8. Katsuaki Suganuma
9. J. Calata
10. Yadong Li

Who trusts Kuan Yew Cheong overall

1. Kim S. Siow

Papers from Kuan Yew Cheong's perspective

Ordered by how strongly the researchers Kuan Yew Cheong trusts endorse each paper. Same corpus, a different order for every researcher.

1. Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly (IEEE transactions on device and materials reliability)
2. Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments (IEEE Aerospace Conference. Proceedings)
3. Synthesis of nanosized silver particles by chemical reduction method
4. A Silver Colloid Produced by Reduction with Hydrazine as Support for Highly Sensitive Surface-Enhanced Raman Spectroscopy†
5. Chemistry and properties of nanocrystals of different shapes. (Chemical Reviews)
6. An assessment of wide bandgap semiconductors for power devices
7. Preparation of metal nanoparticles in water-in-oil (w/o) microemulsions. (Advances in Colloid and Interface Science)
8. Effect of amine groups in the synthesis of Ag nanoparticles using aminosilanes
9. Tailoring surface plasmons through the morphology and assembly of metal nanoparticles. (Langmuir)
10. Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules (2007 IEEE Power Electronics Specialists Conference)

Their papers

• Die Attach Materials for High Temperature Applications: A Review (2011) — 446 citations
• A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices (2010) — 318 citations
• Advances of Ag, Cu, and Ag–Cu alloy nanoparticles synthesized via chemical reduction route (2013) — 190 citations
• Current conduction mechanisms in atomic-layer-deposited HfO2/nitrided SiO2 stacked gate on 4H silicon carbide (2008) — 135 citations
• Mechanisms responsible for improvement of 4H-SiC/SiO2 interface properties by nitridation (2003) — 189 citations
• Electrical and optical studies of ZnO:Ga thin films fabricated via the sol-gel technique (2002) — 179 citations