Kim S. Siow

Electrical and Electronic Engineering · 2006–2021

A researcher in the Science corpus: 6 papers; trusts 10 researchers and is trusted by 6 researchers here, as inferred from the citation graph.

Subfields

Whom Kim S. Siow trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. J. Bai
  2. Guo-Quan Lu
  3. Katsuaki Suganuma
  4. C. Koch
  5. Vemal Raja Manikam
  6. Nikhilesh Chawla
  7. Xu Chen
  8. K. Lu
  9. Kuan Yew Cheong

Who trusts Kim S. Siow overall

  1. Y. T. Lin
  2. Tiam Foo Chen
  3. Chuantong Chen
  4. S. T. Chua
  5. Darem Ahmad
  6. Katsuaki Suganuma
  7. C. Dancer

Papers from Kim S. Siow's perspective

Ordered by how strongly the researchers Kim S. Siow trusts endorse each paper. Same corpus, a different order for every researcher.

  1. Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly (IEEE transactions on device and materials reliability)
  2. Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material (IEEE transactions on components and packaging technologies)
  3. High-temperature electronics - a role for wide bandgap semiconductors? (Proceedings of the IEEE)
  4. High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment (IEEE Transactions on Advanced Packaging)
  5. Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments (IEEE Aerospace Conference. Proceedings)
  6. Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys
  7. Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
  8. Void induced thermal impedance in power semiconductor modules: some transient temperature effects (Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248))
  9. Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
  10. Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules (2007 IEEE Power Electronics Specialists Conference)

Their papers