J. Bai

Electrical and Electronic Engineering · IEEE transactions on components and packaging technologies · 2006–2007

A researcher in the Science corpus: 3 papers; trusts 2 researchers and is trusted by 8 researchers here, as inferred from the citation graph.

Subfields

• Electrical and Electronic Engineering — 5 citations into it; #2,659 of 16,539 by trust here, #8,322 by citations

Whom J. Bai trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

1. Guo-Quan Lu
2. J. Calata

Who trusts J. Bai overall

1. Vemal Raja Manikam
2. J. Calata
3. T. Lei
4. Guo-Quan Lu
5. Kuan Yew Cheong
6. Kim S. Siow
7. Xu Chen

Papers from J. Bai's perspective

Ordered by how strongly the researchers J. Bai trusts endorse each paper. Same corpus, a different order for every researcher.

1. Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material (IEEE transactions on components and packaging technologies)
2. Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly (IEEE transactions on device and materials reliability)
3. High-temperature electronics - a role for wide bandgap semiconductors? (Proceedings of the IEEE)
4. Void induced thermal impedance in power semiconductor modules: some transient temperature effects (Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248))
5. Thermal behavior of silver nanoparticles for low-temperature interconnect applications
6. Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments (IEEE Aerospace Conference. Proceedings)
7. Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
8. Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys
9. Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
10. Silicon carbide benefits and advantages for power electronics circuits and systems (Proceedings of the IEEE)

Their papers

• Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material (2006) — 356 citations
• Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly (2006) — 203 citations
• Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices (2007) — 141 citations