Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow

By Z. Zhang, Guo-Quan Lu. 2002

228 citations recorded by the source corpus.

Subfields: Ceramics and Composites, Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/959c89ac8087ae88abe407686cbcbb420a0500f8

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Ceramics and Composites

1. Guo-Quan Lu
2. Kuan Yew Cheong
3. Vemal Raja Manikam

In Electrical and Electronic Engineering

1. J. Calata
2. Guo-Quan Lu
3. J. Bai
4. Xu Chen
5. S. Luo
6. T. Lei
7. Kuan Yew Cheong
8. Vemal Raja Manikam

In Materials Chemistry

1. Guo-Quan Lu
2. Xu Chen

Citations in the corpus

• Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices (2007, background): “die-attachment can enhance the densification process such that the sintering temperature can be lowered to about 250 C [6], [7].”
• Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material (2006, unknown): “complicate the process and increase cost [13].”
• Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips (2010, background): “To lower the sintering temperature of silver pastes below 300 °C, Scheuermann and Schwarzbauer, and more recently others [8]– [10], applied quasi-hydrostatic pressure on the chip/substrate assembly to speed up the sintering kinetics of silver paste at low-temperatures.”