Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices

By J. Bai, J. Calata, Guo-Quan Lu. IEEE transactions on electronics packaging manufacturing (Print), 2007

141 citations recorded by the source corpus.

Subfields: Ceramics and Composites, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/8e673cee24c2ceab19baf11a7b8f700e38797e84

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Ceramics and Composites

1. Vemal Raja Manikam
2. Kuan Yew Cheong

In Electrical and Electronic Engineering

1. Vemal Raja Manikam
2. Kuan Yew Cheong

Citations in the corpus

• Die Attach Materials for High Temperature Applications: A Review (2011, methodology): “FEA analysis on the elastic modulus for two types of die attach solders [67].”