Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys

By G. Wang, Z. Cheng, K. Becker, J. Wilde. 2001

340 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/9ecf9d83c96a75653cb296b39e264023d1941da5

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Xu Chen
2. Pradeep Lall
3. J. Suhling
4. Z. Cai
5. Zoubir Khatir
6. Guo-Quan Lu
7. Kim S. Siow
8. Kuan Yew Cheong

In Mechanical Engineering

1. Xu Chen
2. Pradeep Lall
3. Guo-Quan Lu
4. J. Suhling
5. Guozheng Kang

In Mechanics of Materials

1. Xu Chen
2. Guozheng Kang

Citations in the corpus

• Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment (2009, positive): “[12] applied Anand model to eutectic Sn–3.”
• Ageing and Failure Modes of IGBT Modules in High-Temperature Power Cycling (2011, background): “works are based on thermomechanical considerations [11]–[16] and are frequently sustained by the use of finite-element (FE) simulation tools [17]–[19].”
• Determination of Anand constants for SAC solders using stress-strain or creep data (2012, methodology): “The Anand model has also been widely used in the finite element simulation of solder interconnection in electronic components [19-22].”