Vemal Raja Manikam

Electrical and Electronic Engineering · 2011

A researcher in the Science corpus: 1 paper; trusts 5 researchers and is trusted by 1 researcher here, as inferred from the citation graph.

Subfields

Whom Vemal Raja Manikam trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. J. Bai
  2. Guo-Quan Lu
  3. Katsuaki Suganuma
  4. J. Calata
  5. Burak Ozpineci

Who trusts Vemal Raja Manikam overall

  1. Kim S. Siow

Papers from Vemal Raja Manikam's perspective

Ordered by how strongly the researchers Vemal Raja Manikam trusts endorse each paper. Same corpus, a different order for every researcher.

  1. Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material (IEEE transactions on components and packaging technologies)
  2. Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly (IEEE transactions on device and materials reliability)
  3. Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments (IEEE Aerospace Conference. Proceedings)
  4. An assessment of wide bandgap semiconductors for power devices
  5. Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules (2007 IEEE Power Electronics Specialists Conference)
  6. High-temperature lead-free solders: Properties and possibilities
  7. Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment
  8. Comparison of Wide-Bandgap Semiconductors for Power Electronics Applications
  9. Review on materials, microsensors, systems and devices for high-temperature and harsh-environment applications (IEEE transactions on industrial electronics (1982. Print))
  10. Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices (IEEE transactions on electronics packaging manufacturing (Print))

Their papers