T. Lei
IEEE transactions on components and packaging technologies · with Calata · 2010
A researcher in the Science corpus: 1 paper; trusts 2 researchers and is trusted by 0 researchers here, as inferred from the citation graph.
Whom T. Lei trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Papers from T. Lei's perspective
Ordered by how strongly the researchers T. Lei trusts endorse each paper. Same corpus, a different order for every researcher.
- Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material (IEEE transactions on components and packaging technologies)
- Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly (IEEE transactions on device and materials reliability)
- Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
- High-temperature electronics - a role for wide bandgap semiconductors? (Proceedings of the IEEE)
- Void induced thermal impedance in power semiconductor modules: some transient temperature effects (Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248))
- Thermal behavior of silver nanoparticles for low-temperature interconnect applications
- Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments (IEEE Aerospace Conference. Proceedings)
- Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys
- Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
- Power transfer capability and bifurcation phenomena of loosely coupled inductive power transfer systems (IEEE transactions on industrial electronics (1982. Print))