Thermal behavior of silver nanoparticles for low-temperature interconnect applications
By Kyoung-Sik Moon, H. Dong, R. Maric, S. Pothukuchi, A. Hunt, Y. Li, C. Wong. 2005
377 citations recorded by the source corpus.
Subfields: Atmospheric Science, Materials Chemistry, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/6e58170804bd6618f3dd1d6248efa55aaea26861
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In Materials Chemistry
In Mechanical Engineering
Citations in the corpus
- High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment (2007, background): “ability of nanoscale silver particles without the need of external pressure and their potential applications in device interconnection have been reported [13].”