J. Calata

Electrical and Electronic Engineering · 2006–2010

A researcher in the Science corpus: 3 papers; trusts 2 researchers and is trusted by 5 researchers here, as inferred from the citation graph.

Subfields

Whom J. Calata trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. J. Bai
  2. Guo-Quan Lu

Who trusts J. Calata overall

  1. Vemal Raja Manikam
  2. J. Bai
  3. Kuan Yew Cheong

Papers from J. Calata's perspective

Ordered by how strongly the researchers J. Calata trusts endorse each paper. Same corpus, a different order for every researcher.

  1. Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material (IEEE transactions on components and packaging technologies)
  2. Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly (IEEE transactions on device and materials reliability)
  3. High-temperature electronics - a role for wide bandgap semiconductors? (Proceedings of the IEEE)
  4. Void induced thermal impedance in power semiconductor modules: some transient temperature effects (Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248))
  5. Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
  6. Thermal behavior of silver nanoparticles for low-temperature interconnect applications
  7. Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments (IEEE Aerospace Conference. Proceedings)
  8. Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys
  9. Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
  10. Silicon carbide benefits and advantages for power electronics circuits and systems (Proceedings of the IEEE)

Their papers