Xu Chen
Mechanical Engineering · with Lu · 2004–2010
A researcher in the Science corpus: 6 papers; trusts 6 researchers and is trusted by 7 researchers here, as inferred from the citation graph.
Subfields
- Mechanical Engineering — 25 citations into it; #2,401 of 8,300 by trust here, #3,966 by citations
- Mechanics of Materials — 20 citations into it; #2,317 of 6,291 by trust here, #2,631 by citations
- Electrical and Electronic Engineering — 9 citations into it; #14,442 of 16,539 by trust here, #9,402 by citations
- Materials Chemistry — 9 citations into it
Whom Xu Chen trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Who trusts Xu Chen overall
Papers from Xu Chen's perspective
Ordered by how strongly the researchers Xu Chen trusts endorse each paper. Same corpus, a different order for every researcher.
- Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material (IEEE transactions on components and packaging technologies)
- Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly (IEEE transactions on device and materials reliability)
- Modeling the Bauschinger effect for sheet metals, part I: theory
- Kinematic hardening rules in uncoupled modeling for multiaxial ratcheting simulation
- Modified kinematic hardening rule for multiaxial ratcheting prediction
- A constitutive model of cyclic plasticity
- Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
- Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys
- Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
- High-temperature electronics - a role for wide bandgap semiconductors? (Proceedings of the IEEE)
Their papers
- Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection (2007) — 339 citations
- Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment (2009) — 181 citations
- Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips (2010) — 223 citations
- On the Ohno–Wang kinematic hardening rules for multiaxial ratcheting modeling of medium carbon steel (2005) — 259 citations
- Moisture sorption-desorption-resorption characteristics and its effect on the mechanical behavior of the epoxy system (2005) — 237 citations
- Modified kinematic hardening rule for multiaxial ratcheting prediction (2004) — 227 citations