Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

By Dunji Yu, Xu Chen, Gang Chen, Guo-Quan Lu, Zhengqu Wang. 2009

181 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/2fa8574e913f77574236a75d716b0be232c6bd02

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. D. Henry
2. Laurent Mendizabal
3. Vemal Raja Manikam
4. Kuan Yew Cheong

In Mechanical Engineering

1. Vemal Raja Manikam
2. Kuan Yew Cheong

Citations in the corpus

• Survey of High-Temperature Reliability of Power Electronics Packaging Components (2015, background): “In fact, the nanosilver joint shows modulus values between 6 and 9 GPa that are lower than those of commonly used solder alloys and represents about 12% of the elastic modulus of the silver bulk [58], [59].”
• Die Attach Materials for High Temperature Applications: A Review (2011, background): “Synthesis of sintered Ag thin film [70], [71].”