Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips

By T. Lei, J. Calata, Guo-Quan Lu, Xu Chen, S. Luo. IEEE transactions on components and packaging technologies, 2010

223 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/b06c47f69e733f12d57752f443a8d62bc3faf7fc