Bongsang Kim

Electrical and Electronic Engineering · 2006–2009

A researcher in the Science corpus: 6 papers; trusts 2 researchers and is trusted by 1 researcher here, as inferred from the citation graph.

Subfields

Whom Bongsang Kim trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. Rob N. Candler
  2. Woo-Tae Park
  3. Singiresu S. Rao
  4. Liwei Lin

Who trusts Bongsang Kim overall

  1. R. Melamud
  2. J. Salvia
  3. Matt Hopcroft
  4. Saurabh A. Chandorkar
  5. J.T.M. van Beek
  6. Eldwin Jiaqiang Ng
  7. Thomas W. Kenny
  8. Guoqiang Wu

Papers from Bongsang Kim's perspective

Ordered by how strongly the researchers Bongsang Kim trusts endorse each paper. Same corpus, a different order for every researcher.

  1. MEMS post-packaging by localized heating and bonding
  2. Single wafer encapsulation of MEMS devices
  3. A 12 MHz micromechanical bulk acoustic mode oscillator
  4. Vacuum packaging technology using localized aluminum/silicon-to-glass bonding (Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090))
  5. Thermal conduction in doped single-crystal silicon films
  6. High-cycle fatigue of single-crystal silicon thin films
  7. Micromechanical "hollow-disk" ring resonators (17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest)
  8. Thermoelastic damping in fine-grained polysilicon flexural beam resonators
  9. MEMS technology for timing and frequency control (IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control)
  10. Thin Film Materials: Stress, Defect Formation and Surface Evolution

Their papers