Long-Term and Accelerated Life Testing of a Novel Single-Wafer Vacuum Encapsulation for MEMS Resonators

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Wafer level packaging of MEMS (2008, unknown): “The resonator is made of silicon single crystal and sealed with chemically vapor deposited poly-Si [69].”
Temperature Dependence of the Elastic Constants of Doped Silicon (2015, methodology): “The epi-seal process is a wafer-scale, hermetic encapsulation process that seals the MEMS within an ultra-clean, sub-Pa vacuum cavity that is free from native oxide [24], [25].”
MEMS Resonators for Frequency Reference and Timing Applications (2020, methodology): “Above all, MEMS resonators fabricated using the Epi-seal process, have demonstrated good long term stability with no noticeable long term drift [12], [119], [120].”
Temperature-Insensitive Composite Micromechanical Resonators (2009, methodology): “The fabrication and packaging of these composite resonators is derived from the “epi-seal” technology previously developed for silicon resonators [ 16 ], [17].”
Temperature Dependence of Quality Factor in MEMS Resonators (2006, unknown): “All the resonators were encapsulated by our epi-seal process which leaves only less than 1 Pa hydrogen in the cavity and privides a perfect hermetic seal [7, 8].”