Matt Hopcroft

Electrical and Electronic Engineering · 2006–2010

A researcher in the Science corpus: 7 papers; trusts 3 researchers and is trusted by 2 researchers here, as inferred from the citation graph.

Subfields

Whom Matt Hopcroft trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. Bongsang Kim
  2. Rob N. Candler
  3. Liwei Lin

Who trusts Matt Hopcroft overall

  1. Eldwin Jiaqiang Ng
  2. R. Melamud
  3. V. Hong
  4. Guoqiang Wu
  5. Yushi Yang

Papers from Matt Hopcroft's perspective

Ordered by how strongly the researchers Matt Hopcroft trusts endorse each paper. Same corpus, a different order for every researcher.

  1. MEMS post-packaging by localized heating and bonding
  2. A 12 MHz micromechanical bulk acoustic mode oscillator
  3. Single wafer encapsulation of MEMS devices
  4. Vacuum packaging technology using localized aluminum/silicon-to-glass bonding (Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090))
  5. Thermal conduction in doped single-crystal silicon films
  6. High-cycle fatigue of single-crystal silicon thin films
  7. Micromechanical "hollow-disk" ring resonators (17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest)
  8. Thermoelastic damping in fine-grained polysilicon flexural beam resonators
  9. MEMS technology for timing and frequency control (IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control)
  10. Thin Film Materials: Stress, Defect Formation and Surface Evolution

Their papers