Impact of geometry on thermoelastic dissipation in micromechanical resonant beams
By Rob N. Candler, Amy E. Duwel, Mathew Varghese, Saurabh A. Chandorkar, Matt Hopcroft, Woo-Tae Park, Bongsang Kim, Gary Yama, Aaron Partridge, Markus Lutz and 1 more. Journal of microelectromechanical systems, 2006
138 citations recorded by the source corpus.
Subfields: Atomic and Molecular Physics, and Optics, Electrical and Electronic Engineering, Mechanics of Materials
View Paper: https://www.semanticscholar.org/paper/4d857c4e52d48b0ba2bc70645ed3aa2ea076e53e
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Atomic and Molecular Physics, and Optics
- Eldwin Jiaqiang Ng
- Thomas W. Kenny
- S. Vengallatore
- S. Prabhakar
- Saurabh A. Chandorkar
- R. Melamud
- Matt Hopcroft
- Bongsang Kim
In Electrical and Electronic Engineering
- Eldwin Jiaqiang Ng
- Thomas W. Kenny
- S. Vengallatore
- S. Prabhakar
- Saurabh A. Chandorkar
- R. Melamud
- Matt Hopcroft
- Bongsang Kim
In Mechanics of Materials
Citations in the corpus
- Temperature Dependence of Quality Factor in MEMS Resonators (2006, unknown): “This phenomenon is well described by the above expression for simple, rectangular beams, and can be modeled for other geometries [4, 5].”
- Temperature-Insensitive Composite Micromechanical Resonators (2009, background): “The lowest quality factor is attained when the overlap between the thermal and mechanical modes is maximized [22], [23].”
- Theory of Thermoelastic Damping in Micromechanical Resonators With Two-Dimensional Heat Conduction (2008, methodology): “complex geometries, numerical analysis using the method of finite elements is necessary to compute TED [20], [36].”
- Temperature Dependence of the Elastic Constants of Doped Silicon (2015, background): “The Q for most of these resonators are known to be limited by thermoelastic dissipation [29]–[31], but could also be limited by the Akhieser effect [32] for the Lamé modes without release-etch holes.”