Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

By Yu-Ting Cheng, Wan-Tai Hsu, Khalil Najafi, C. T. Nguyen, Liwei Lin. Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090), 2002

170 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/a0dfbef1ff4a6e4f4dfe0853872a29e330852ad5

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. Thomas W. Kenny
2. R. Melamud
3. Matt Hopcroft
4. Masayoshi Esashi
5. Woo-Tae Park
6. Bongsang Kim
7. Rob N. Candler
8. Gary Yama

Citations in the corpus

• Micropackaging Technologies for Integrated Microsystems: Applications to MEMS and MOEMS (2003, methodology): “The vacuum package presented here is based on localized aluminum/silicon to glass solder bonding technique reported previously [45-52].”
• Long-Term and Accelerated Life Testing of a Novel Single-Wafer Vacuum Encapsulation for MEMS Resonators (2006, methodology): “ized heating with polysilicon [2], [4], [8], [9], and gold [2] microheaters for thermally activated bonding has been used, and a review of bonding via localized heating from microheaters is given by Lin [10].”
• Wafer level packaging of MEMS (2008, methodology): “electrical heater under the solder on the chip [30, 31].”