MEMS post-packaging by localized heating and bonding

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Long-Term and Accelerated Life Testing of a Novel Single-Wafer Vacuum Encapsulation for MEMS Resonators (2006, methodology): “ized heating with polysilicon [2], [4], [8], [9], and gold [2] microheaters for thermally activated bonding has been used, and a review of bonding via localized heating from microheaters is given by Lin [10].”
Vacuum packaging technology using localized aluminum/silicon-to-glass bonding (2002, background): “The bonding temperature can be estimated from the temperature of the microheater since bonding occurs at the interface between the heater and silicon or glass cap [16].”
Single wafer encapsulation of MEMS devices (2003, methodology): “A thorough review of localized heating and bonding processes was written by Lin [6].”
Stamp-and-stick room-temperature bonding technique for microdevices (2005, background): “Lin and others [5]–[7] improved this process to bond locally using”
Micropackaging Technologies for Integrated Microsystems: Applications to MEMS and MOEMS (2003, methodology): “To do this, a variety of bonding techniques has been utilized [29-63].”