Frequency stability of wafer-scale film encapsulated silicon based MEMS resonators
By Bongsang Kim, Rob N. Candler, Matt Hopcroft, M. Agarwal, Woo-Tae Park, Thomas W. Kenny. 2007
151 citations recorded by the source corpus.
Subfields: Atomic and Molecular Physics, and Optics, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/df0de30b3df85a8c380a60398a99ae16ba84d53c
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In Atomic and Molecular Physics, and Optics
- Thomas W. Kenny
- Saurabh A. Chandorkar
- R. Melamud
- Matt Hopcroft
- Bongsang Kim
- Robert Puers
- J.T.M. van Beek
- Scott F. Lord
In Electrical and Electronic Engineering
- Thomas W. Kenny
- Saurabh A. Chandorkar
- R. Melamud
- Matt Hopcroft
- Bongsang Kim
- Robert Puers
- J.T.M. van Beek
- Scott F. Lord
Citations in the corpus
- Temperature-Insensitive Composite Micromechanical Resonators (2009, methodology): “[17] have previously shown that silicon resonators encapsulated using the “epi-seal” process exhibit frequency stability better than ±3.”
- A review of MEMS oscillators for frequency reference and timing applications (2011, background): “few ppm [16, 39], thereby rivaling or even exceeding the aging”
- Temperature Dependence of Quality Factor in MEMS Resonators (2006, unknown): “During this final seal, native oxides and all organic contaminants are removed [7], [33].”
- Real-Time Temperature Compensation of MEMS Oscillators Using an Integrated Micro-Oven and a Phase-Locked Loop (2010, background): “Long-term experiments with silicon microresonators fabricated in the episeal process have demonstrated sub-parts-per-millionper-year aging rates [20].”