Single wafer encapsulation of MEMS devices
By Rob N. Candler, Woo-Tae Park, Huimou J. Li, Gary Yama, Aaron Partridge, Markus Lutz, Thomas W. Kenny. 2003
181 citations recorded by the source corpus.
Subfields: Atomic and Molecular Physics, and Optics, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/be452db4f3f2c33af2f6e132d871796cd8cfb31f
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In Atomic and Molecular Physics, and Optics
- Thomas W. Kenny
- Eldwin Jiaqiang Ng
- Wen Chen
- Jinghui Xu
- Guoqiang Wu
- R. Melamud
- Saurabh A. Chandorkar
- Matt Hopcroft
In Electrical and Electronic Engineering
- Thomas W. Kenny
- Eldwin Jiaqiang Ng
- Wen Chen
- Jinghui Xu
- Guoqiang Wu
- R. Melamud
- Saurabh A. Chandorkar
- Matt Hopcroft
Citations in the corpus
- MEMS Resonators for Frequency Reference and Timing Applications (2020, methodology): “The most popular used thin-film encapsulation method is the Epitaxial seal (EpiSeal), which has been successful for high-stability timing devices [12], [118]–[120].”
- Frequency stability of wafer-scale film encapsulated silicon based MEMS resonators (2007, methodology): “The resonators investigated here were fabricated using a single-wafer polysilicon thin-film encapsulation process [16,17,19].”
- Impact of geometry on thermoelastic dissipation in micromechanical resonant beams (2006, background): “[19, 30 ], Figure 6, which provides a hermetic seal at a pressure < 0.003 mBar.”
- Long-Term and Accelerated Life Testing of a Novel Single-Wafer Vacuum Encapsulation for MEMS Resonators (2006, methodology): “Previous work used a silicon encapsulation that was sealed with LPCVD oxide at 450°C [29-32].”