R. Melamud

Electrical and Electronic Engineering · 2006–2010

A researcher in the Science corpus: 6 papers; trusts 4 researchers and is trusted by 5 researchers here, as inferred from the citation graph.

Subfields

Whom R. Melamud trusts overall

Their strongest outbound trust, strongest first, inferred from their citations.

  1. Bongsang Kim
  2. Singiresu S. Rao
  3. Rob N. Candler
  4. C. T. Nguyen
  5. Matt Hopcroft

Who trusts R. Melamud overall

  1. Eldwin Jiaqiang Ng
  2. Guoqiang Wu
  3. Jinghui Xu
  4. V. Hong
  5. Saurabh A. Chandorkar

Papers from R. Melamud's perspective

Ordered by how strongly the researchers R. Melamud trusts endorse each paper. Same corpus, a different order for every researcher.

  1. MEMS post-packaging by localized heating and bonding
  2. Single wafer encapsulation of MEMS devices
  3. Vacuum packaging technology using localized aluminum/silicon-to-glass bonding (Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090))
  4. MEMS technology for timing and frequency control (IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control)
  5. Thin Film Materials: Stress, Defect Formation and Surface Evolution
  6. Impact of geometry on thermoelastic dissipation in micromechanical resonant beams (Journal of microelectromechanical systems)
  7. Temperature-compensated high-stability silicon resonators
  8. Vibration of Continuous Systems
  9. Stiffness-compensated temperature-insensitive micromechanical resonators (Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266))
  10. Temperature Dependence of Quality Factor in MEMS Resonators (Journal of microelectromechanical systems)

Their papers