Y. T. Lin
Electrical and Electronic Engineering · 2016
A researcher in the Science corpus: 1 paper; trusts 1 researcher and is trusted by 0 researchers here, as inferred from the citation graph.
Subfields
- Electrical and Electronic Engineering — 6 citations into it
- Mechanical Engineering — 5 citations into it
Whom Y. T. Lin trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Papers from Y. T. Lin's perspective
Ordered by how strongly the researchers Y. T. Lin trusts endorse each paper. Same corpus, a different order for every researcher.
- State of the art of high temperature power electronics
- Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging? (Journal of Electronic Materials)
- Low temperature sinter technology die attachment for power electronic applications (2010 6th International Conference on Integrated Power Electronics Systems)
- Microstructure and mechanical behavior of porous sintered steels
- Instrumented Indentation Testing
- High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment (IEEE Transactions on Advanced Packaging)
- Power Conversion With SiC Devices at Extremely High Ambient Temperatures (IEEE transactions on power electronics)
- Quantitative characterization of spatial clustering in three-dimensional microstructures using two-point correlation functions
- Metal Matrix Composites
- Three-dimensional (3D) microstructure visualization and finite element modeling of the mechanical behavior of SiC particle reinforced aluminum composites