Tiam Foo Chen
Electrical and Electronic Engineering · 2021
A researcher in the Science corpus: 1 paper; trusts 1 researcher and is trusted by 0 researchers here, as inferred from the citation graph.
Subfields
- Electrical and Electronic Engineering — 13 citations into it
- Mechanical Engineering — 6 citations into it
Whom Tiam Foo Chen trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Papers from Tiam Foo Chen's perspective
Ordered by how strongly the researchers Tiam Foo Chen trusts endorse each paper. Same corpus, a different order for every researcher.
- Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material (IEEE transactions on components and packaging technologies)
- Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly (IEEE transactions on device and materials reliability)
- Void induced thermal impedance in power semiconductor modules: some transient temperature effects (Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248))
- High-temperature electronics - a role for wide bandgap semiconductors? (Proceedings of the IEEE)
- Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
- Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys
- Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
- The influence of element Y on the mechanical properties of the as-extruded Mg-Zn-Y-Zr alloys
- Mechanical Properties and Stacking Fault Energies of NiFeCrCoMn High-Entropy Alloy
- High-strength extruded Mg–Al–Ca–Mn alloy