Chuantong Chen
Electrical and Electronic Engineering · 2019
A researcher in the Science corpus: 1 paper; trusts 1 researcher and is trusted by 0 researchers here, as inferred from the citation graph.
Subfields
- Electrical and Electronic Engineering — 15 citations into it
- Mechanical Engineering — 7 citations into it
Whom Chuantong Chen trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Papers from Chuantong Chen's perspective
Ordered by how strongly the researchers Chuantong Chen trusts endorse each paper. Same corpus, a different order for every researcher.
- Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material (IEEE transactions on components and packaging technologies)
- Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly (IEEE transactions on device and materials reliability)
- High-temperature electronics - a role for wide bandgap semiconductors? (Proceedings of the IEEE)
- Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments (IEEE Aerospace Conference. Proceedings)
- Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
- Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules (2007 IEEE Power Electronics Specialists Conference)
- High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment (IEEE Transactions on Advanced Packaging)
- Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment
- Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
- New regime of homogeneous flow in the deformation map of metallic glasses: elevated temperature nanoindentation experiments and mechanistic modeling